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para light electronics co., ltd. 4f, no.1, lane 93, chien yi road, chung ho city, taipei, taiwan. tel: 886-2-2225-3733 fax: 886-2-2225-4800 e-mail: para@para.com.tw http://www.para.com.tw data sheet part no.: L-C155TBJSCT-5A rev: a/0 customers approval: _______________ dcc: ____________ drawing no.: ds-31-09-xxxx date: 2009-06-30 page 1 of 13 para-for-065
surface mount device led part no.: L-C155TBJSCT-5A rev:a/0 package outline dimensions notes: 1 .? : yellow; ? :blue 2. all dimensions are in millimeters. 3. tolerance is 0.1mm (.004") unless otherwise noted. features dual color, top view, wide view angle chip led . package in 8mm tape on 7" diameter reels. compatible with automatic pick & place equipment. compatible with reflow soldering and wave soldering processes. eia std package. i.c. compatible. pb free product. drawing no.: ds-31-09-xxxx date: 2009-06-30 page 2 of 13 para-for-068
surface mount device led part no.: L-C155TBJSCT-5A rev:a/0 chip materials chip light color dice material lens color ? tb:blue incan ? js : yellow allncap water clear absolute maximum ratings (ta=25 ) rating symbol parameter blue yellow unit p d power dissipation 76 75 mw i pf peak forward current (1/10 duty cycle, 0.1ms pulse width) 100 80 ma i f continuous forward current 20 30 ma - de-rating linear from 25 0.25 0.4 ma/ v r reverse voltage 5 5 v esd electrostatic discharge threshold (hbm) note a 2000 topr operating temperature range -20 ~ +80 tstg storage temperature range -30 ~ +100 - wave soldering condition (two times max.) 260 (fo r 5 seconds) - infrared soldering condition (two times max.) 260 (for 10 seconds) note a: hbm: human body model. seller gives no other assura nces regarding the ability of to withstand esd. electro-optical characteristics (ta=25 ) parameter symbol blue yellow unit test condition min. 4.5 4.5 typ. luminous intensity max. iv 45.0 45.0 mcd if=5ma viewing angle typ. 2 1/2 130 deg note 2 peak wavelength typ. p 468 591 nm measurement @peak dominant wavelength typ. d 470 589 nm if=5ma spectral line half-width typ. ? 25 15 nm typ. 3.1 2.0 forward voltage max. vf 3.6 2.4 v if =5ma reverse current max. ir 10 a vr = 5v drawing no.: ds-31-09-xxxx date: 2009-06-30 page 3 of 13 para-for-068
surface mount device led part no.: L-C155TBJSCT-5A rev:a/0 notes: 1. luminous intensity is measured with a light sensor and filter combination that proximities the cie eye-response curve. 2. 1/2 is the off-axis angle at which the luminous intensi ty is half the axial luminous intensity. 3. the dominant wavelength d is derived from the cie chromaticity diagram and represents the single wavelength which defines the color of the device. 4. caution in esd: static electricity and surge damages the led. it is recommended use a wrist band or anti-electrostatic glove when handling the led. all devices, equipment and machinery must be properly grounded. 5. major standard testing equipment by instrument sys tem model: cas140b compact array spectrometer and keithley source meter mode l: 2400. typical electro-optical characteristics curves drawing no.: ds-31-09-xxxx date: 2009-06-30 page 4 of 13 para-for-068
surface mount device led part no.: L-C155TBJSCT-5A rev:a/0 blue and yellow typical electro-optical characteris tics curve s (25 ambient temperature unless otherwise noted) drawing no.: ds-31-09-xxxx date: 2009-06-30 page 5 of 13 para-for-068
surface mount device led part no.: L-C155TBJSCT-5A rev:a/0 label explanation cus. part no: to be denominated. customer: to be denominated. part no: refer to p15 batch: mnga m--- a chip luminous intensity code n--- b chip luminous intensity code ga--- a chip dominant wavelength code lot no: e l s 4 7 0009 a---e: for series number b---l: local f: foreign c---s: smd d---year e---month f---spec. quantity: 3000pcs for 150 110 155 115 195 series 4000pcs for 191 series 5000pcs for 192 series drawing no.: ds-31-09-xxxx date: 2009-06-30 page 6 of 13 para-for-068 a b c d e f
surface mount device led part no.: L-C155TBJSCT-5A rev:a/0 reel dimensions drawing no.: ds-31-09-xxxx date: 2009-06-30 page 7 of 13 para-for-068
surface mount device led part no.: L-C155TBJSCT-5A rev:a/0 package dimensions of tape and reel notes: all dimensions are in millimeters. moisture resistant packaging p a r a l i g h t p a r a l i g h t label aluminum moistue-proof bag desiccant label h:\smd\smd\smd \ ? ? .jpg h:\smd\smd\smd \ ? ? .jpg h : \ s m d \ s m d \ s m d \ ? ? . j p g h : \ s m d \ s m d \ s m d \ ? ? . j p g 2 5 5 435 145 2 4 0 2 1 0 label box carton reel notes: one reel in a bag, one bag in a inner box, t en inner boxes in a carton. unit: mm. drawing no.: ds-31-09-xxxx date: 2009-06-30 page 8 of 13 para-for-068
surface mount device led part no.: L-C155TBJSCT-5A rev:a/0 cleaning if cleaning is required , use the following solutio ns for less than 1 minute and less than 40 . appropriate chemicals: ethyl alcohol and isopropyl alcohol. effect of ultrasonic cleaning on the led resin body differs depending on such factors as the oscillator output, size of pcb and led mounting method. the use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. suggest soldering pad dimensions direction of pwb camber and go to reflow furnace drawing no.: ds-31-09-xxxx date: 2009-06-30 page 9 of 13 para-for-068
surface mount device led part no.: L-C155TBJSCT-5A rev:a/0 drawing no.: ds-31-09-xxxx date: 2009-06-30 page 10of 13 para-for-068
surface mount device led part no.: L-C155TBJSCT-5A rev:a/0 bin code list cautions 1.application limitation: the leds described here are intended to be used fo r ordinary electronic equipment (such as office equ ipment, communication equipment and household application). consult paras sales in advance for information on application in which exceptional quality and reliability are re quired, particularly when the failure or malfunctio n of the leds may directly jeopardize life or health (such as airplan es, automobiles, traffic control equipment, life su pport system and safety devices). 2.storage: before opening the package: the leds should be kept at 5c to 30c or less and 85%rh or less. the leds should be used within a yea r. after opening the package: the leds should be kept at 5c to 30c or less and 70%rh or less. the leds should be soldered within 1 68 hours (7 days) after opening the package. please avoid rapid transitions in ambient temperatu re in high humidity environments where condensation may occur. 3.soldering do not apply any stress to the lead frame during so ldering while the led is at high temperature. recommended soldering condition. reflow soldering: pre-heat 120~150c, 120sec. max., peak temperature : 240c max. soldering time: 10 sec max. soldering iron: (not recommended) temperature 300c max., soldering time : 3 sec. max .(one time only), power dissipation of iron : 20w m ax. use sn60 solder of solder with silver content and dont to t ouch led lens when soldering. drawing no.: ds-31-09-xxxx date: 2009-06- 30 page 11of 13 para-for-068
surface mount device led part no.: L-C155TBJSCT-5A rev:a/0 wave soldering: pre-heat 100c max, pre-heat time 60 sec. max, sold er wave 260c max, soldering time 5 sec. max. prefo rmed consecutively cooling process is required between 1 st and 2 nd soldering processes. 4. lead-free soldering for reflow soldering: 1 pre-heat temp:150-180 ,120sec.max. 2 soldering temp: temperature of soldering pot over 2 30 ,40sec.max. 3 peak temperature:260 5sec. 4 reflow repetition:2 times max. 5 suggest solder paste formula 93.3 sn/3.1 ag/3.1 bi /0.5 cu for soldering iron (not recommended): 1 iron tip temp:350 max. 2 soldering iron:30w max. 3 soldering time:3 sec. max. one time. for dip soldering: 1 pre-heat temp:150 max. 120 sec. max. 2 bath temp:265 max. 3 dip time:5 sec. max. 5. drive method circuit model a circuit model b (a)recommended circuit. (b)the difference of brightness between led`s could be found due to the vf-if characteristics of led. drawing no.: ds-31-09-xxxx date: 2009-06-30 page 12of 13 para-for-068
surface mount device led part no.: L-C155TBJSCT-5A rev:a/0 6.reliability test classification test item test condition reference standard operation life ta= under room temperature as per data sheet maximum rating * test time= 1000hrs (-24hrs,+72hrs)*@20ma. mil-std-750d: 1026 (1995) mil-std-883d: 1005 (1991) jis c 7021:b-1 (1982) high temperature high humidity storage ir-reflow in-board, 2 times ta= 655 ,rh= 90 95% *test time= 1000hrs2hrs mil-std-202f: 103b(1980) jis c 7021: b-11 (1982) high temperature storage ta= 1055 test time= 1000hrs (-24hrs, 72hrs) mil-std-883d: 1008 (1991) jis c 7021:b-10 (1982) endurance test low temperature storage ta= -555 * test time=1000hrs (-24hrs, 72h rs) jis c 7021:b-12 (1982) temperature cycling 1055 -555 10mins 10mins 100 cycles mil-std-202f: 107d (1980) mil-std-750d: 1051(1995) mil-std-883d: 1010 (1991) jis c 7021: a-4 (1982) thermal shock ir-reflow in-board, 2 times 1055 -55 5 10mins 10mins 100 cycles mil-std-202f: 107d(1980) mil-std-750d: 1051(1995) mil-std-883d: 1011(1991) solder resistance tsol= 260 5 dwell time= 10 1sec mil-std-202f: 210a(1980) mil-std-750d: 2031(1995) jis c 7021: a-1 (1982) environmental test solder ability tsol= 235 5 immersion time 20.5 sec immersion rate 252.5 mm/sec coverage R 95% of the dipped surface mil-std-202f: 208d(1980) mil-std-750d: 2026(1995) mil-std-883d: 2003(1991) iec 68 part 2-20 jis c 7021: a-2 (1982) 7.others: the appearance and specifications of the product ma y be modified for improvement without notice. drawing no.: ds-31-09-xxxx date: 2009-06-30 page 13of 13 para-for-068

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